相位陣列天線微波成像系統、毫米波之探針量測、以及差動式覆晶訊號傳輸架構之研製

Researches of Phase Array Microwave Imaging System, Millimeter-Wave Probe Measurement, and Differential Flip-Chip Interconnection

陳文權(Wen-Quan Chen)

指導教授 ： 蔡作敏

國立中正大學/工學院/電機工程學系/碩士(2014年)

摘要

本論文有三大研究方向：使用反傅氏轉換與Lucy-Richardson去模糊法實現相位陣列天線微波成像系統、1-Port之SOL校正法量測毫米波之探針、以及差動式覆晶訊號傳輸架構。
首先，本論文先探討反傅氏轉換之效果成像，並使用號角天線實現微波成像，其2D成像效果略差，其中之原因為之號角天線之主波束寬度很寬，所以Lucy-Richardson去模糊法與號角天線之主波束可將2D成像效果變好。在使用到1X4相位陣列天線微波成像系統，其中心頻為5 GHz，頻寬為500 MHz，取51個點，使其距離解析度為0.3 m，量測最遠距離為15 m。做兩種微波成像系統掃描物體(1)機械式掃描(2)電子切換式掃描，並各別量測兩種待測方式，而兩種微波成像系統之成像結果相同，但電子切換式微波成像系統之成像效果較差，其原因為電子切換式微波成像系統與機械式微波成像系統多相移器之6 dB之損耗。其二，本論文分別量測26 GHz、67 GHz、110 GHz探針之高頻特性，將探針之輸出接Open、Short、Load並從輸入量測S-參數， 將26 GHz、67 GHz、110 GHz探針之高頻特性量測出來，並使用Thru驗證，其植入損耗之誤差在0.2 dB以內。其三，本論文探討差動式覆晶與G-S-G覆晶之比較，而差動式覆晶需使用平衡不平衡轉換器(Balun) 才能連接微帶線，G-S-G覆晶則需要做補償，使其有較好特性，然而使用94 GHz低雜訊放大器做整合，差動式覆晶因使用平衡不平衡轉換器(Balun)故整合特性略差，但單純差動式覆晶與G-S-G覆晶之特性相同，在模擬中，100 GHz~140 GHz之G-S-G覆晶之植入損耗比單純差動式覆晶多0.2 dB~1 dB。

關鍵字

差動式覆晶 ； Lucy-Richardson ； 微波成像

並列摘要

The thesis had three researches. They were phase array microwave imaging system, millimeter-wave probe measurement, and differential flip-chip interconnection.
Frist, the thesis discussed imaging results with inverse Fourier transform, and used horn antenna achieved microwave imaging. The 2D imaging results were bad, because the beamwidth of horn antenna was width. So the pattern of horn antenna and the deconvolution with Lucy-Richardson method let the 2D imaging become good. Design microwave imaging system with 1X4 phase array, the center frequency was 5 GHz, the bandwidth was 500 MHz for 51 frequency points. The distance resolution of imaging system was 0.3m, and measuring the distance was 15 m. Design two microwave imaging systems to scan objects with (1) mechanical and (2) electron switching. The measurements of microwave imaging systems were same. But, the microwave imaging system with electron switching was worse then with mechanical. The reason was more 6 dB losses of imaging systems with electron switching for phase shifter. Second, the thesis measured S-parameters of the probes for 26 GHz, 67 GHz and 110 GHz. Let G-S-G terminal of the probe connect open, short, and load in calibration substrate, and measured S11 from coaxial terminal. So it measured S-parameters of the probes for 26 GHz, 67 GHz and 110 GHz. And used connection of two probes, its insertion loss error was 0.2 dB. Third, the thesis researched comparison between differential flip-chip to G-S-G flip-chip. The differential flip-chip had to use baluns and connected microstrip. G-S-G flip-chip flip-chip had to match. Let they have better effect. However, let 94 GHz low-noise- amplifier integration with two flip-chips. Differential flip-chip needed to use baluns, so the effects of integration were worse. But, effect of differential flip-chip without baluns and effect of G-S-G flip-chip flip-chip were same. In 100 GHz~140 GHz simulation, G-S-G flip-chip had more 0.2~1 dB losses than differential flip-chip without baluns.

並列關鍵字

Differential Flip-Chip ； Lucy-Richardson ； Microwave Imaging

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