水冷頭水道的安排對於水冷散熱系統性能的影響

Effect of Channel Arrangement on the Performance of Liquid Cooling System

陳國銓(Kuo-Chuan Chen)

指導教授 ： 李基禎 ； 郭鴻森

大同大學/工程學院/機械工程學系所/碩士(2009年)

摘要

近年來，隨著半導體技術不斷進步，電子系統效能不斷的提升，但伴隨著高發熱量的問題也越來越嚴重，為了解決此問題發展了許多形式的散熱裝置，其中水冷散熱系統也是眾多發展的項目之ㄧ。
本文利用電子熱傳分析軟體Icepak，以數值模擬的方法，探討水冷頭在散熱方式、鰭片距離、尺寸、流道深度、銅底厚度等等各種不同的參數作用之下，對於散熱性能的變化與影響。之後再配合實際製作的方式，將水冷頭的樣品製作出來，在恆溫恆溼室內下進行測試其熱阻值，並跟數值模擬的結果相互比較與驗證。
研究結果發現，在邊界條件、出入水口距離、流量、外觀尺寸、水道寬度4.25mm、水道底部與熱源之距離2.5mm都相同的銅塊上，當水道與水道之間的距離為1.75mm時，散熱效果最好，而水道與水道之間的距離為0.5mm的散熱效果最差。在邊界條件、出入水口距離、流量、外觀尺寸都相同的銅塊上，當水道底部與熱源之距離為2.5mm水道深11mm時，散熱效果最好，而水道底部與熱源之距離1.5mm水道深12mm的散熱效果最差。在邊界條件、出入水口距離、流量、水道底部距離熱源的厚度都相同時，當水冷頭內部與水接觸之面積增加，對於散熱是有相當大的幫助。在相同流量下的排列式水冷頭之水道底部與熱源之距離4mm與鰭片高度4mm，對散熱的效能較好。在邊界條件、流量，外觀尺寸大小都相同的全銅水冷頭，水道底部與熱源之距離5.5mm鰭片高度13.5mm此比例的散熱效能較好。

關鍵字

水冷

並列摘要

In recent years, the performance of electronic system has advanced steadily with the progress of semiconductor technology. Overheating has also become more and more serious. In order to solve this problem many forms of heat dissipation have been developed. The water cooling system is one of the numerous research aspects.
This article uses the electronic heat distribution analysis software Icepak to do the numerical simulation. It analyzes the effects of the fin piece distance, dimensions, flow channel depth, copper plate thickness, and other factors on the nature of the water block’s heat dissipation. Then, the water block sample is prepared, and put inside the temperature and humidity testing chamber to test its thermal resistance value, and compared with results from the simulation.
Research shows that when the environmental factors, water outlet inlet distance, current capacity, exterior dimensions, canal width of 4.25mm, canal base and heat source distance of 2.5mm of the copper plates are nearly the same in both the simulation and actual test. The heat dissipation is most effective when canal distance is 1.75mm, and worst when it’s 0.5mm.
For plates with the same environmental factors, water outlet inlet distance, current capacity, exterior dimensions, heat dissipation is best in case of canal base and heat source are 2.5mm apart, and canal is 11mm deep. It is worst when canal base and heat source are 1.5mm apart, and canal is 12mm deep.
For the same environmental factors, water outlet inlet distance, current capacity, and distance between canal base and heat source, it is found that increase in the contact area between the water block interior and water is advantageous to heat dissipation.
For the same the same current capacity arrangement under the water block, it is found that heat dissipation is best when canal base is 4mm apart from heat source and fin piece is 4mm high.
For the same environmental factors, current capacity, exterior dimensions of the copper plates, it is found that heat dissipation is best when canal base is 5.5mm apart from heat source, and fin piece is 13.5mm high

並列關鍵字

Liquid Cooling

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