This work applies finite element method (FEM) to study the accelerometer mass effect on print circuit board (PCB) during experimental modal testing. The FE modal considering accelerometer mass by different simulation approaches are presented and optimized to determine the PCB material mechanical properties by the comparison between the theoretical and experimental modal parameters. In FEM, both modal analysis and harmonic response analysis are, respectively, performed to get theoretical natural frequency and mode shapes as well as frequency response functions (FRFs). From experimental modal testing, the corresponding modal parameters and FRFs can also be obtained and used to validate the constructed FE modals including mass effect due to the accelerometer. The most reasonable modeling of the accelerometer mass in conjunction with the PCB FE modal can be found and result in very good agreement with experiments in terms of model parameters and FRFs. The refined PCB modal with the accelerometer mass effect can then be applied to response prediction with better and reliable comparison with experiments and thus improve the simulation accuracy.