- 期刊
- OpenAccess
The Study of large Area and low Temperature die Bonding
並列摘要
The critical concerns of heat radiation for Light Emitting Diode (LED) includes the LED material and the following packaging material and process. From the view point of LED structure, the heat resistance of the die attachment layer is the dominant actor of the heat radiation for LED. A well bonding die attachment layer benefits the heat radiation of LED. The ITRI-Bond was utilized in this paper, and has a well effect in die bonding of the large LED and Cu plate. Therefore, this paper develop an instrument for die attachment under local vacuum condition. The required properties of this instrument include vacuuming the chamber within 5sec and the bonding void of LED less than 3%.
被引用紀錄
王壽愷（2006）。微型甲醇燃料電池之表面奈米化陽極電催化測試與微氣泡觀測研究〔碩士論文，國立清華大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0016-1303200709301008
延伸閱讀
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